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CT Microporous Board is manufactured from high-purity silicate and Ti₂Si₂O₅ powder combined with special binders. Based on advanced microporous technology, this insulation product exhibits extremely low thermal conductivity, which is even lower than that of still air under atmospheric pressure. Its insulation performance is 3–10 times higher than that of traditional fiber insulation materials.
1. Ultra-low thermal conductivity: Thermal insulation performance is 3–4 times better than that of conventional insulation materials.
2. Excellent high-temperature performance: Suitable for continuous use up to 1000 °C, with very low linear shrinkage.
3. Outstanding thermal properties: Low specific heat capacity, low heat storage, and excellent thermal shock resistance.
4. Eco-friendly: Non-fibrous, non-toxic, and harmless; compliant with international environmental protection requirements.
5. Easy installation: Easy to cut, punch, shape, and bond.
6. Water-resistant option: Hydrophobic grades are available and can be used in moisture-containing environments.
Thermal insulation for industrial kilns and back-up linings of equipment in petrochemical, ceramic, glass, mechanical, non-ferrous metallurgy, power generation, boiler equipment, and heating furnaces
Thermal insulation for metallurgical ladles, tundishes, transfer ladles, and pouring equipment
Insulation applications in the household appliance industry
Heat preservation and cold storage applications
Name | CT N1200 | CT N1000 | CT N900 |
Classification temperature ℃ | 1200℃ | 1000℃ | 900℃ |
Density(kg/m³) | 220-350 | 220 | 220 |
Linear shrinkage | ＜2% | ＜2% | ＜2% |
Chemical Composition | SiO2 45% Ti2Si2O5 + SiO2 50% | SiO2 50% Ti2Si2O5 + SiO2 45% | SiO2 45% Ti2Si2O5 + SiO2 45% |
